| abstract |
A pore filling composition. The present invention relates to a composition comprising a polymer and a solvent, wherein the polymer comprises: the following general formula (I) repeating unit: Where: Ar 1 , Ar 2 , Ar 3 and Ar 4 independently represent optionally substituted divalent aromatic groups; X 1 and X 2 independently represent single bonds, -O-, -C(O)- , -C(O)O-, -OC(O)-, -C(O)NR 1 -, -NR 2 C(O)-, -S-, -S(O)-, -SO 2 - or Optionally substituted C 1-20 divalent hydrocarbon groups, wherein R 1 and R 2 independently represent H or C 1-20 hydrocarbon groups; m is 0 or 1; n is 0 or 1; and o is 0 or 1; and free of polymerizable vinyl and hydroxyl capping groups. The compositions find particular applicability in semiconductor device fabrication for forming low-k and ultra-low-k dielectric materials. |