http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105728977-B

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-262
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-362
filingDate 2016-04-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2018-06-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2018-06-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-105728977-B
titleOfInvention A kind of high reliability low temperature lead-free tin cream and preparation method thereof
abstract The invention discloses a kind of high reliability low temperature lead-free tin creams and preparation method thereof.Be by weight ratio be 88.5 90.0:10 11.5 solder powder and scaling powder mixes.The ingredient of solder powder includes(By weight percentage):Sn:48 56%, Ag:1.0 1.4%, rare earth Ge/Nd:0.1 0.15%, In surplus.In the raw material that the present invention selects, the fusing point of solder powder alloy is low, good mechanical property, thermal fatigue resistance are good, can meet the high reliability that tin cream uses in low temperature environment;The boiling point of scaling powder is relatively low, can meet the requirement of other components in solvent dissolving scaling powder in welding process, while after the completion of welding, scaling powder volatilizees substantially, reduces postwelding residual;The fusing point of activating agent is relatively low, it is ensured that maximum effect is played in welding process, removes the oxidation film of substrate, reduces the surface tension of solder, promotes the wetting of tin cream and substrate;Thixotropic agent can ensure without sedimentation, without layering during tin cream storage, smooth in printing process.
priorityDate 2016-04-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 47.