abstract |
The semiconductor component of the present invention includes a semiconductor package, a bump, and a covering portion, and the semiconductor package has a mounting surface. The bumps are made of the first solder, and are formed on the mounting surface. The coating portion is composed of the first composition containing the solder powder composed of the second solder, the flux component, and the first thermosetting resin binder, and coats the tip end portion of the bump. |