| abstract |
The present invention, which provides one kind, cored structure solder bump and its manufacturing method.When manufacturing solder bump, cloth wick slurry is applied in the central part printing of salient point in advance, and near the reflow treatment temperature of solder metal or its temperature below is sintered core with slurry, sintering core is consequently formed, then solder metal is coated with around the sintering core with print process, and reflow treatment is carried out to the solder metal, to obtain having cored structure solder bump what the inside of solder bump was formed with the sintering core extended in the vertical direction. |