Predicate |
Object |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1436 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02024 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02052 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
filingDate |
2014-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2018-06-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2018-06-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
CN-105593330-B |
titleOfInvention |
Composition for polishing and its manufacturing method |
abstract |
The present invention provides a kind of composition for polishing that can efficiently reduce surface defect.According to the present invention, it is possible to provide include water soluble polymer M C‑end Composition for polishing.Aforementioned water soluble polymer M C‑end Main chain include as it is main composition region non-cationic region and positioned at the cationic region of at least one end of the main chain.Aforesaid cations region has at least one cationic groups. |
priorityDate |
2013-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |