http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105590905-B
Outgoing Links
Predicate | Object |
---|---|
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
filingDate | 2015-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2021-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2021-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-105590905-B |
titleOfInvention | Electronic device sealing sheet and method for manufacturing electronic device package |
abstract | The invention provides an electronic device sealing sheet which has low viscosity and can be highly filled with an inorganic filler. The solution of the present invention is an electronic device sealing sheet using a compound having a methacryloxy group or an acryloxy group as a silane coupling agent, containing an inorganic filler in a range of 69 to 86 vol%, and having a minimum viscosity in a range of 10 to 1000000Pa ยท s. |
priorityDate | 2014-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 60.