| abstract |
The present invention provides conductive ink compositions that have a good balance between adhesion to substrates, stability of submicron sized particles, ability to sinter at relatively low temperatures, and good electrical conductivity. In one aspect, the present invention provides conductive networks prepared from compositions according to the present invention. In some aspects, such conductive networks are suitable for use in touch panel displays. In certain aspects, the present invention relates to methods of bonding submicron silver particles to non-metallic substrates. In certain aspects, the present invention relates to methods of improving the adhesion of submicron silver filled compositions to non-metallic substrates. |