| abstract |
The present invention provides the manufacturing method that can reduce buckling deformation caused by the volume contraction of heat-curing resin piece and the excellent semiconductor chip thermosetting encapsulation resin sheet and semiconductor package body of Robustness and ordering.The present invention relates to a kind of semiconductor chip thermosetting encapsulation resin sheets, its activation energy (Ea) meets following formula (1), and the glass transition temperature of the thermosetting compound after 150 DEG C of heat cures are handled 1 hour is 125 DEG C or more, thermalexpansioncoefficientα [ppm/K] and above-mentioned thermosetting compound storage elastic modulus E at 25 DEG C ' [GPa] of the above-mentioned thermosetting compound at above-mentioned glass transition temperature temperature below meet following formula (2).30≤Ea≤120[kJ/mol]···(1)10000≤α×E'≤300000[Pa/K]···(2) |