http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105549324-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-031 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
| filingDate | 2015-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-105549324-B |
| titleOfInvention | Photocuring and thermally curable resin composition and dry-film type solder resist |
| abstract | Provide a kind of photocuring and thermally curable resin composition and dry-film type solder resist prepared therefrom, the photocuring and thermally curable resin composition include: sour modified oligomer comprising the iminocarbonic ester based compound containing carboxyl and photocuring unsaturated functional group；The monomer of photopolymerization has two or more photocuring unsaturated functional groups；Hot setting adhesive, with thermalcurable functional group；Functional filler comprising selected from the one or more with ceramic compound carbon allotrope particle combined thereon and heat radiation ceramic particle；And photoinitiator. |
| priorityDate | 2014-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 257.