http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105538827-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-73 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-306 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-088 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-126 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B37-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088 |
| filingDate | 2015-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2018-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-105538827-B |
| titleOfInvention | A kind of two layers of method double side flexible copper coated board and preparation method thereof |
| abstract | The present invention relates to printed wiring board technical field more particularly to a kind of two layers of method double side flexible copper coated board, including upper and lower two copper foil layer and the polyimide insulative layer being located in successively between two copper foil layers；The polyimide insulative layer is by the polyamide thermoplastic acid resin glue containing acetenyl after hot imidization or chemical imidization, using heat treatment, non-thermal plasticity polyimide insulative layer is made so that the acetenyl in thermoplastic polyimide to be promoted to crosslink；The present invention is due to the use of acetenyl, the cementation between non-thermal plasticity polyimides and copper foil is enhanced, improves peel strength, simultaneously, non-thermal plasticity polyimides after heat cure further improves Tg, peel strength, dimensional stability, and with relatively low hydroscopicity；In addition, the preparation method the invention further relates to two layers of method double side flexible copper coated board. |
| priorityDate | 2015-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 82.