http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105505302-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-02 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-388 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J183-08 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-388 |
| filingDate | 2015-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2018-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-105505302-B |
| titleOfInvention | Double cured modified organic silicon adhesives of ultraviolet light-moisture and preparation method thereof |
| abstract | The invention discloses double cured modified organic silicon adhesives of a kind of ultraviolet light moisture and preparation method thereof, and the organic silicon adhesive its raw material group in parts by weight becomes：100 parts of modified polyorganosiloxane, α, 5~20 parts of ω dialkyl polydimethylsiloxanes, 1~10 part of silicone oil plasticizer, 1~10 part of gas-phase silica, 1~5 part of diluent, 1~4 part of photoinitiator, 1~3 part of catalyst.The organic silicon adhesive of the present invention can be shaped, shadow region can be complete by moisture-curable under ultraviolet light with rapid curing；Environmentally protective, efficient pollution-free meets environmental requirement；There is good high-low temperature resistant, weather resistance, electrical insulation capability, physical mechanical property and adhesive property simultaneously, can be widely applied to the bonding embedding of multiple material, the especially fields such as electronic apparatus, illuminator bonds encapsulation. |
| priorityDate | 2015-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 74.