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filingDate 2014-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2019-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2019-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-105453223-B
titleOfInvention The improvement silicon wafer carrier of thermal uniformity feature with enhancing
abstract A kind of silicon wafer carrier component, used in by chemical vapor deposition (CVD) in the system of one or more wafer growing epitaxial layers, silicon wafer carrier component includes the silicon wafer carrier main body being symmetrically formed about central axis, it includes and being parallel to top surface, the bottom surface for plane perpendicular to the central axis, substantially planar top surface.At least one wafer keeps bag to be recessed in silicon wafer carrier main body from top surface.It includes bottom surface and peripheral wall surface that at least one wafer, which keeps each of bag, and peripheral wall surface surrounds bottom surface and defines the periphery that wafer keeps bag.At least one thermal control feature includes the internal cavities or hole formed in silicon wafer carrier main body, is defined by the inner surface of silicon wafer carrier main body.
priorityDate 2013-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 22.