| abstract |
The invention belongs to low dielectric resin composition technical field, prepreg, resin film, laminated plates and the circuit board for disclosing a kind of low dielectric resin composition of phosphonium flame retardant and being prepared based on it.Said composition includes following components：(A) phosphonium flame retardant；(B) vinyl compound.Described phosphonium flame retardant has the structure as shown in formula (one). The present invention to diphenyl phosphorus oxygen by performing the derivatization, and the phosphonium flame retardant prepared does not have reactive functionality, with more preferable dielectric property；And fusing point is high, the resin combination that collocation vinyl compound is obtained is prepared with relatively low thermel expansion rate, superior heat resistance, compared with high glass transition temperature and compared with low-k and the substrate of dielectric loss, on the premise of without using halogen flame, UL94V 0 flame retardant efficiency is effectively reached, be can be applied in manufacture prepreg, resin film, gum copper foil, flexible gum copper foil, laminated plates and circuit board. |