| abstract |
The present disclosure is directed to forming a bond with high peel resistance between an adhesive layer and an adjacent barrier layer. Such articles are particularly useful in making devices, particularly light emitting devices, and this disclosure describes methods of assembling light emitting devices. The light emitting device includes an encapsulation system using a flexible transparent barrier film and an ultraviolet (UV) radiation curable (meth)acrylate matrix. For example, the moisture-sensitive light-emitting material may be a quantum dot material disposed on a film, or a film construction including an OLED structure. |