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filingDate 2014-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2018-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2018-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-105408998-B
titleOfInvention The manufacturing method of coating bonding wire and the coating bonding wire used in bare die packaging body
abstract The present invention relates to a kind of leads, with metal core (202), dielectric layer (200,204) and the metal (206) that can be grounded, wherein the lead also has one or more moisture barrier coatings.In addition, the present invention relates to the bare die packaging bodies at least one lead according to the present invention.
priorityDate 2013-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 49.