| abstract |
The present invention relates to the prevention of A method and composition thereof for further loss of dielectric constant of an underlying layer. In one aspect, the method comprises contacting the porous low dielectric constant film with at least one organosilicon compound to provide an absorbing organosilicon compound and treating the absorbing organosilicon compound with ultraviolet light, plasma, or both, and repeating until Form a pore sealing layer of desired thickness. |