http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105331320-B
Outgoing Links
Predicate | Object |
---|---|
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 |
filingDate | 2015-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2018-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2018-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-105331320-B |
titleOfInvention | A kind of epoxyn of low viscosity high activity |
abstract | The invention discloses a kind of epoxyn of low viscosity high activity, including component have bisphenol A epoxide resin E51, DGRE resin, 4,4 ' MDA epoxy resin, fatty amines curing agent, the epoxy hardeners of H 4, accelerator and zinc oxide, by bisphenol A epoxide resin E51, DGRE resin and 4,4 ' MDA epoxy resin are mixed and heated, the epoxy hardeners of H 4 are added to stir, cooling adds fatty amines curing agent, accelerator and zinc oxide, stirs and uses.Through the above way, the adhesive of the present invention is the epoxy-resin systems for having low-viscosity and excellent mechanical performances, the selection of curing agent and inorganic filler can effectively improve the tensile strength and shear strength of resin, each component compatibility is good in the curing process, curing reaction is complete, can the fast reaction within the scope of a wider temperature, reach the effect of adhesive quick-drying. |
priorityDate | 2015-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 32.