http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105315614-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68 |
| filingDate | 2014-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2018-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-105315614-B |
| titleOfInvention | Thermosetting resin composition for hole filling of printed circuit board, cured product, and printed circuit board |
| abstract | The present invention provides a thermosetting resin composition for hole filling of a printed wiring board, a cured product, and a printed wiring board. The thermosetting resin composition for hole filling of a printed circuit board is characterized by containing: (A) a specific isocyanate-modified epoxy resin, (B) a thermosetting component, (C) a filler, (D) a thermal The compounding quantity of the said (C) filler is 45-90 mass % with respect to the said thermosetting resin composition whole quantity of a curing catalyst and (E) reactive diluent. |
| priorityDate | 2014-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 149.