| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-51
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2439-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2555-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2255-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2519-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2255-02 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B5-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61F13-515
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J157-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L91-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61F13-49009
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-142
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J123-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J123-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-08 |
| filingDate |
2014-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2018-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-105308141-B |
| titleOfInvention |
Hot-melt adhesive based on low melting point polypropylene homopolymer |
| abstract |
There is the DSC fusing points less than 100 DEG C wherein the hot-melt adhesive has the polypropylene homopolymer of a) by weight about 10% to about 70% with the hot-melt adhesive on porous-substrates；B) about 10% to about 60% the first tackifying resin, with about 95 DEG C to about 140 DEG C of ring and ball softening point；C) about 0% to about 65% second tackifying resins different from the first tackifying resin；D) plasticizer of about 5% to about 50%；E) second polymer of by weight about 1% to about 40% is semi-crystalline polymer or wax that fusion enthalpy is more than 30 joule/grams；F) about 0.1% to about 5% stabilizer or antioxidant；Wherein component amounts to by weight the 100% of composition, and the viscosity of composition is equal to or less than about 20 at 163 DEG C (325 °F), 000 centipoise (cP). |
| priorityDate |
2013-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |