http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105301905-B
Outgoing Links
Predicate | Object |
---|---|
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-427 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0392 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0397 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-38 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039 |
filingDate | 2015-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2020-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2020-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-105301905-B |
titleOfInvention | Chemically amplified positive resist composition and patterning method |
abstract | A chemically amplified positive resist composition is provided which comprises a substantially alkali-insoluble polymer having an acid functional group protected by an acid labile group, a poly (meth) acrylate polymer having an Mw of 1,000-500,000, and an acid generator in a solvent. The composition forms a resist film of 5 to 100 μm thickness on a substrate, which can be developed in a short time to form a pattern under high sensitivity and high removal or dissolution. |
priorityDate | 2014-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 859.