http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105296792-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C32-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C1-10 |
| filingDate | 2015-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-105296792-B |
| titleOfInvention | Ceramic strengthening copper base composite used for electronic packaging and preparation method thereof |
| abstract | The invention provides ceramic strengthening copper base composite used for electronic packaging and preparation method thereof.Described ceramic strengthening copper base composite used for electronic packaging, it is characterised in that its raw material includes surface preparation ceramic powders 30vol%~90vol%, copper 10vol%~70vol%, wherein, described surface preparation is：Tungsten metal or the processing of Mo metallic surface cladding.Because ceramic surface preprocess method causes it to coat W or Mo metal levels, greatly improve mutual wetability between thing phase, thus the material prepared by the present invention with conventional electronic package material compared with more excellent thermal conductivity, thermal coefficient of expansion and mechanical property；The liquid-phase infiltrating method used has advantage that is simple to operate, with low cost, being adapted to large-scale production. |
| priorityDate | 2015-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 31.