http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105280690-B

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filingDate 2015-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2021-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2021-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-105280690-B
titleOfInvention Semiconductor device
abstract The invention discloses a technology that can improve the electromigration endurance of an electrode. A portion of the drain electrode (DE) is formed in the side surface (DSF) of the drain pad (DP). At this time, the drain electrode (DE) and the drain pad (DP) are integrally formed, and extend in the first direction (y direction) from the side surface (DSF) in plan view. The recessed portion (DRE) is located on a region overlapping the drain electrode (DE) in plan view. At least a part of the drain electrode (DE) is buried in the recess (DRE). Viewed in the first direction (y-direction), the side surface (side surface RDS) of the recess (DRE) facing the drain pad (DP) is embedded in the drain pad (DP).
priorityDate 2014-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 33.