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filingDate 2014-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2019-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2019-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-105280641-B
titleOfInvention Structures and methods for integrated circuits
abstract The present invention provides many different embodiments of an IC device. The IC device includes a gate stack disposed over a surface of the substrate and spacers disposed along sidewalls of the gate stack. The spacer has a surface facing the substrate while tapering edges that taper toward the gate stack. Therefore, the tapered edge is angled relative to the surface of the substrate. The present invention also provides a method of manufacturing a semiconductor integrated circuit (IC) device.
priorityDate 2014-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 33.