| abstract |
The present invention provides a device utilizing a dummy pad feature adjacent to a contact pad and a method of manufacturing the same. The contact pads may be contact pads in an integrated fan-out package where the molding compound is placed along the sides of the die and the contact pads extend over the die and molding compound. The contact pads are electrically connected to the die using one or more redistribution layers. The dummy pad feature is electrically isolated from the contact pad. In some embodiments, the dummy pad feature partially surrounds the contact pad and is located in a corner region of the molding compound, in a center region of the die, and/or in an interface region between an edge of the die and the molding compound. The present invention relates to contact pads for semiconductor devices. |