| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36f8253f3d0d59bcd9259217d4385d10 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0257
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49109
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R19-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05554
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48137
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48257
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L9-0042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-2047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-1071
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-0023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-02 |
| filingDate |
2015-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a9a6f52ab51709b8cb48731dcbf28d98
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bffdee2ab90d0d5856b8d8cb2f3f9377
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8618296e67b7f36705d89396b3ba7573
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_171b8555b730e6c8f3083189e8f41e91 |
| publicationDate |
2016-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-105280561-A |
| titleOfInvention |
MEMS Sensor Structure Based on Lead Frame |
| abstract |
The present invention relates to lead frame based MEMS sensor structures. A sensor structure is disclosed. The sensor structure may include: a lead frame for supporting the MEMS sensor; a recess in a surface of the lead frame; and a MEMS sensor coupled to the surface of the lead frame and disposed over the recess to form a cavity. Alternatively, the lead frame may have a perforation formed therethrough and the MEMS sensor may be coupled to the surface of the lead frame and disposed over the opening of the perforation. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113483941-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111443230-A |
| priorityDate |
2014-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |