| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M10-052
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E60-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E60-13 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G11-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M4-808
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M4-0471
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M4-661
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G11-86
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M10-0525
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G11-70
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-665
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G11-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C1-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M4-80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M4-0469 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01M4-80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C1-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01M4-13 |
| filingDate |
2014-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2017-05-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2017-05-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-105247084-B |
| titleOfInvention |
Production method for porous aluminum body, porous aluminum body, current collector, electrode, and electrochemical device |
| abstract |
Provided is a production method for a porous aluminum body that comprises: a step in which a resin structure is produced by using molten salt electrolytic plating to form an aluminum film of the surface of a resin substrate having a three-dimensional mesh structure; a step in which moisture is removed from the resin structure; and a step in which the resin structure from which moisture has been removed is heat treated to remove the substrate. It is preferable that the resin structure be heat treated at a temperature of 50-300 DEG C at the step in which moisture is removed from the resin structure, and that the resin structure be heated at a temperature that is equal to or greater than 370 DEG C and lower than the melting point of aluminum at the step in which the substrate is removed. |
| priorityDate |
2013-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |