| abstract |
The present invention relates to a multilayer barrier adhesive film for encapsulation of electronic devices such as organic light emitting diodes (OLEDs), photovoltaic devices and thin film transistors. The multilayer adhesive film comprises at least one barrier layer disposed adjacent to at least one adhesive layer. In one embodiment, the barrier layer is a fluoropolymer. The fluoropolymer is preferably a homopolymer of tetrafluoroethylene (PTFE) or a homopolymer of chlorotrifluoroethylene (PCTFE), or a copolymer thereof. |