http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105230137-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_52ad66ea7dd7e3f1a616f27ef29327ec |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1581 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3478 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10106 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3494 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-19 |
| filingDate | 2014-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ce784d36c3cbf9376d365015f1f06e5d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8124ea322ce884582a609f49d6ead7d2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_038e11288659f7c1c537f8475d010e63 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fe87787de887dfb42981bbf42f8a04e3 |
| publicationDate | 2016-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-105230137-A |
| titleOfInvention | Electronic component mounting equipment |
| abstract | The invention provides a kind of erecting device of electronic component, the damage of electronic component, the dispersing and the damage of substrate of solder can be suppressed, and can with than the time short in the past to printing distributing board soldering of electronic components.The erecting device (100) of electronic component of the present invention (112) is at the upper installing electronic elements (108) of the printing distributing board (122) with the Wiring pattern (122B) on flexible base plate (122A) and described substrate, it comprises: feedway (102), is supplied to by solder (104) on the Wiring pattern (122B) of printing distributing board (122); Mounting apparatus (106), solder (104) loads electronic component (108); And laser (110), towards the solder (104) loading electronic component (108), there is the light of luminescence center wavelength in the scope that the back side (124) side of printing distributing board is radiated at 700nm ~ 1100nm, and arrive Wiring pattern (122B) in light transmission substrate (122A), Wiring pattern (122B) is heated and solder (104) is melted, thus electronic component (108) is welded on printing distributing board (122). |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I777684-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114120847-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112638058-A |
| priorityDate | 2013-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID449789534 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID16217673 |
Total number of triples: 26.