http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105229098-B

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1436
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
filingDate 2014-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2017-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2017-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-105229098-B
titleOfInvention Comprising N, N, the chemical-mechanical polishing compositions of (2 hydroxypropyl) ethylenediamines of N ', N ' tetra- or methanesulfonic acid
abstract A kind of chemically mechanical polishing (CMP) composition of present invention description, it includes following components:(A) in the surface modified silicon dioxide particle of scope negative zeta potential with 15mV or below 15mV under 2 to 6 pH value, (B) N, N, N', (2 hydroxypropyl) ethylenediamines of N' tetra- or methanesulfonic acid, (C) water, (D) chooses any one kind of them or various other compositions, and wherein the pH value of composition is in the range of 2 to 6.
priorityDate 2013-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 55.