http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105219274-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31053 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3105 |
| filingDate | 2007-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-105219274-B |
| titleOfInvention | Compositions and methods for chemical mechanical polishing of low dielectric constant dielectric materials |
| abstract | The present invention provides a composition and method for chemical mechanical polishing of low dielectric constant dielectric materials. The composition comprises a particulate abrasive material, at least one silicone-free nonionic surfactant comprising a hydrophilic portion and a lipophilic portion, at least one silicone-containing nonionic comprising a hydrophilic portion and a lipophilic portion Surfactant, and aqueous carrier therefor. Also disclosed are CMP methods for polishing low-k dielectric surfaces using the compositions. |
| priorityDate | 2006-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 50.