http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105199480-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-104 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-103 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-101 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-03 |
| filingDate | 2015-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-105199480-B |
| titleOfInvention | A kind of photocurable solder resist ink composition |
| abstract | The invention relates to the field of inks, in particular to a photocurable solder resist ink composition. A light-curing solder resist ink composition is composed of the following components by weight: 10-20 parts of β-hydroxyethyl acrylate modified melamine formaldehyde resin; 20-35 parts of hyperbranched resin; 15-30 parts of reactive diluent 10-20 parts of inorganic fillers; 0-15 parts of pigments; 0-8 parts of functional additives; 2-6 parts of photoinitiators. The invention provides a photocurable solder resist ink composition. Compared with the traditional solder resist ink produced in China, the solder resist ink prepared by the invention has fast curing speed, strong adhesion and excellent heat resistance. , solder resistance, yellowing resistance and other characteristics, and especially suitable for LED solder resist ink. |
| priorityDate | 2015-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 61.