| abstract |
The present invention relates to a kind of copper-clad plate composition epoxy resin and its application, which can be used for the preparation of prepreg and copper-clad laminate.The present invention is by using brominated epoxy resins such as low brominated epoxy, High Bromine epoxy Resins as bromo element source, there is luxuriant and rich with fragrance type compound to be used as P elements source using phosphorous, and adjust both ratios in composition epoxy resin, make bromine content control 5 12%, phosphorus content control is 0.2 1.5%, its anti-flammability is up to 0 grade of UL94V；There is the heat resistance of higher compared with the fire-retardant copper-clad plate of pure bromine, and can reach compared with high CTI value；Hydroscopicity is relatively low compared with the fire-retardant copper-clad plate of pure phosphorus, and can provide printed circuit base material required adhesive property, and process operability.With the high CTI plates of tradition largely using aluminium hydroxide compared with, the present invention can be with minimal amount or without aluminium hydroxide with regard to that can reach CTI>600V. |