| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81815
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-814
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31504
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81193
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68377
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31855
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81024
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31721
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2804
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-28 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3164
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-544
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
2011-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2018-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-105153954-B |
| titleOfInvention |
Film for flip chip type semiconductor back surface and application thereof |
| abstract |
The present invention relates to film for flip chip type semiconductor back surface and application thereof.The present invention relates to film for flip chip type semiconductor back surface; it will be set on the semiconductor element back side that flip-chip is connected on adherend; the film for flip chip type semiconductor back surface includes adhesive phase and the protective layer that is laminated on adhesive phase; wherein protective layer is constituted or is consisted of metal by the heat-resistant resin for being 200 DEG C or more with glass transition temperature, wherein the film for flip chip type semiconductor back surface is the form for being wound into scroll. |
| priorityDate |
2010-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |