| abstract |
The present invention is to provide a kind of resin combination, and it is included：(A) polyimide resin；(B) pre- dimerization maleimide resin；(C) thermosetting resin；And (D) fire retardant；Wherein, the synthetic reaction thing of the polyimide resin includes acid anhydrides and diamines, and the diamines includes 4,4 ' two aminodiphenylmethane class compounds and polyether diamine (Polyetherdiamine) class compound.The present invention is by including the polyimide resin synthesized by specific structure diamines and the maleimide resin through pre- dimerization, resin film or semi-solid preparation film can be fabricated to, so as to can reach the circuit substrate characteristics such as low-k, low-dielectric loss, high-fire resistance and high adherence, and then reach the purpose that can be applied to metal laminated plate and printed circuit board (PCB). |