abstract |
A method of manufacturing a solder circuit board, characterized in that the following steps are performed in sequence: a resist forming step of partially covering the surface of a conductive circuit electrode on a printed wiring board with a resist; an adhesive portion forming step, the a process of imparting adhesiveness to a portion of the electrode surface of the conductive circuit that is not covered with a resist to form an adhered portion; a solder attaching process of adhering solder powder to the adhered portion; a resist removing process of a step of removing the resist; and a first heating step of heating the printed wiring board to melt solder powder. |