http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105122956-B

Outgoing Links

Predicate Object
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09127
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09781
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10734
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09227
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4697
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-183
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18
filingDate 2013-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2018-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2018-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-105122956-B
titleOfInvention Semi-finished product for producing printed circuit board and the method for producing it
abstract In the semi-finished product (1) for producing the printed circuit board for carrying at least one embedded-type electric subassembly, it carries at least one conductive layer (13), it is structured to provide connector pad (3) for electronic unit, it is connected to the fan-out line (4) of the connector pad (3), and further provide at least one laser arresting stop (6) around the connector pad (3), wherein the laser arresting stop (6) carries at least one access (8), for making those fan-out lines (4) pass through, the semi-finished product (1) further include at least one coating for being applied to the conductive layer (13) (2'), (2') at least one coating carries the opening (11) being aligned with each access (8).The method that the present invention is used to produce the printed circuit board at least one embedded components is characterized in that following steps:At least one conductive layer (13) is provided, by the conductive layer (13) structuring, to provide connector pad (3) for electronic unit, it is connected to the fan-out line (4) of the connector pad (3), and further provide at least one laser arresting stop (6) around the connector pad (3), there are at least one access (8) in the laser arresting stop (6), for making those fan-out lines (4) pass through, and apply coating (2') to the conductive layer (13), (2') the coating carries the opening (11) being aligned with each access (8).
priorityDate 2012-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559553
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419491804
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5460341
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458437694
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559505
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5462224
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5359268
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559552
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23994
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5360545

Total number of triples: 30.