http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105111987-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 |
| filingDate | 2015-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-105111987-B |
| titleOfInvention | Aqueous phase conductive silver glue prepared by a kind of emulsion |
| abstract | The invention discloses aqueous phase conductive silver glue prepared by a kind of emulsion, its composition includes：Flake silver powder, 50 60%；Epoxy resin latex, 10 30%；Curing agent, 2 5%；Curing accelerator, 0.5 1%；Water, 0 35.3%；Hydroxypropyl methyl cellulose, 1 3%；Terephthalic acid (TPA), 0.5 1%；Nano silicon, 0.5 1%；Water-soluble defoamer, 0.1 0.5%；ICAM8401 or 8402,0.1 0.5%.The conductive silver glue uses water as solvent, pollution-free；Can rapid curing, convenient use under middle normal temperature. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109468088-A |
| priorityDate | 2015-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 50.