http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105102678-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1157 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-538 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-385 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C26-00 |
| filingDate | 2014-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2018-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-105102678-B |
| titleOfInvention | Surface treatment copper foil and the copper clad laminate obtained with surface treatment copper foil |
| abstract | The object of the present invention is to provide one kind compared with non-roughening copper foil, there is the good adaptation with insulating resin base material, and with the copper foil of the good etching performance equal with non-roughening copper foil.In order to realize the purpose, the present invention is using a kind of surface treatment copper foil etc., the surface treatment copper foil is the surface treatment copper foil being roughened to the surface of copper foil, it is characterized in that, have on the surface of the copper foil with maximum length is below 500nm, the roughening treatment surface that is roughened of needle-shaped or plate micro concavo-convex that copper complex chemical compound is formed.And then the copper complex chemical compound preferably has the composition that cuprous oxide is 50%~99%, surplus is copper oxide and impurity. |
| priorityDate | 2013-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 38.