| abstract |
The invention discloses a kind of wafer encapsulation body and its manufacturing method, which includes: a first device substrate, is attached on a first surface of a second device substrate；One 3rd device substrate is attached at second device substrate relative on a second surface of first surface；One insulating layer, covering first device substrate, second device substrate and 3rd device substrate, wherein at least one opening in insulating layer；An at least convex block is set to the bottom part down of opening；And one reroute layer, be set on insulating layer, and be electrically connected to convex block via opening.Device substrate/chip of multiple and different sizes can be stacked vertically and is integrated in same wafer package body by the present invention, so that single wafer packaging body has the function of a variety of integrated circuits, therefore can reduce the size of the circuit board of subsequent engagement. |