http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105087936-A

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classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P10-20
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22B7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22B25-06
filingDate 2015-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a344bdde09322c7ffb81cf401909eff5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2573c9c0e0ce1c8f312937ee6ea7a95
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publicationDate 2015-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-105087936-A
titleOfInvention Low-temperature detinning method for secondary lead bullion
abstract The invention relates to a low-temperature detinning method for secondary lead bullion. The secondary lead bullion is fed into an alloying furnace, the temperature rises, and the secondary lead bullion is molten; when the alloy temperature rises to 380-420 DEG C, sodium chloride and sodium nitrate of the appropriate amount are fed into in batches and stirred for 30-40 minutes; then sodium nitrate and sodium hydroxide of the appropriate amount are fed into alloy fluid; the sodium nitrate and the sodium hydroxide are stirred into yellow or dark yellow particles after reacting for 120-150 minutes; and particle-shaped solder splash is fished out, valuable metal antimony is left in lead fluid, and the solder splash with higher solder content is obtained. In addition, the solder content of the solder splash can reach 40-50%.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105603224-A
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priorityDate 2015-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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