http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105086605-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_56386db860f3250dc1f8142cf81c21a6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2921c09c0d67b9a4b4d0d7f27f1e8e58 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-102 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-101 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-17 |
filingDate | 2015-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c99f1de7684855a015c399401d4f5047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f2eab1364be57eaf5fb92b11373521f6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c0c2aa8896226f82c6c9588e6087d328 |
publicationDate | 2015-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-105086605-A |
titleOfInvention | Photocuring-thermocuring composite ink, application and circuit board containing photocuring-thermocuring composite ink |
abstract | The invention provides photocuring-thermocuring composite ink. The ink comprises the following components: A, 10 to 60% of photopolymerization resin with an molecule containing carboxyl and an unsaturated double bond; B, 2 to 20% of a photopolymerization unsaturated double-bond monomer; C, 0.5 to 20% of hydantoin epoxy resin; D, 2 to 20% of epoxy resin; E, 0.1 to 5% of an epoxy curing accelerator; F, 0.1 to 15% of a photopolymerization initiator; G, 10 to 70% of a filler; H, 0 to 10% of pigment; I, 0.1 to 5% of a defoaming agent; meanwhile, the ink also comprises a leveling agent, an antioxidant, an adhesion promotor, a thixotropic agent and a solvent. The composite ink is applied in printing an insulation solder protectant of a circuit and has good performcances like solder heat resistance, developability, adhesiveness, hardness, alkali resistance, acid resistance, solvent resistance, etc. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109988283-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105778726-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105778726-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112226149-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112226149-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109988283-A |
priorityDate | 2015-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 195.