http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105081614-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-362 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-362 |
| filingDate | 2015-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-105081614-B |
| titleOfInvention | A kind of pre- preserved material of OSP |
| abstract | Welding technology field is protected the present invention relates to printed circuit board (PCB), and in particular to a kind of pre- preserved material of OSP, the pre- preserved material of OSP includes the raw material of following component：The 50g/L of ring ketone compounds 30, the 5g/L of aminated compounds 1, water surplus.The pre- preserved material of OSP of the present invention can be initially formed active layer in copper face, accelerate the formation speed that organic guarantor welds film, can increase the thickness more than 20% that organic guarantor welds thickness within the identical reaction time.The pre- preserved material of OSP of the present invention is the higher alkaline pre-preg agent liquid medicine of pH value, it is possible to reduce the corrosion to copper face, reduces the metallic pollution speed of tank liquor, its service life can be made to extend one times；It is also prevented from Jafani effect, it can be ensured that preferably printed circuit board (PCB) outward appearance；The thickness of the intermetallic compound after scolding tin can be reduced, it is ensured that the shear strength and welding spot reliability of plumb joint. |
| priorityDate | 2015-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 79.