| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2995-0013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2509-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29499
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-14655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2105-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2995-0007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29L2031-3481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C2045-14663
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2063-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3733
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-0013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3737
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C35-0288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4334
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49575
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28 |
| filingDate |
2014-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2017-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2017-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-105074909-B |
| titleOfInvention |
Thermal conductivity insulating trip, power model and its manufacture method |
| abstract |
In order to ensure excellent thermal conductivity and electrical insulating property, when possessing the power model for the thermal conductivity insulating trip being scattered in the inorganic filling material containing the secondary aggregation particle for having condensed the primary particle of flakey boron nitride in heat-curing resin by transfer moudling manufacture, carrying out the solidification of uncured or semi-cured state thermal conductivity insulating trip with the rate of change for the curing degree for causing the thermal conductivity insulating trip represented by following formula (1) turns into more than 30%.The rate of change (%) of the curing degree of thermal conductivity insulating trip=[(B C)/B] × 100 (1) are (in formula, B represents the thermal discharge (cal/g) that uncured or semi-cured state the thermal conductivity insulating trip before transfer modling is determined before being fully cured with differential scanning calorimeter, and C represents the thermal discharge (cal/g) determined after uncured or semi-cured state the thermal conductivity insulating trip before by transfer modling heats 90 seconds at 180 DEG C before being fully cured with differential scanning calorimeter). |
| priorityDate |
2013-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |