| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76849
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-44 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1841
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1844
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1831
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-182 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18 |
| filingDate |
2014-01-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2018-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-105051254-B |
| titleOfInvention |
Method for activation of copper surfaces for electroless plating |
| abstract |
The present invention relates to a method for activating copper or copper alloy surfaces to deposit a metal or metal alloy layer thereon by electroless (autocatalytic) electroplating, wherein the formation of unwanted pores is suppressed. The copper or copper alloy surface is contacted with palladium ions, at least one phosphonate compound and halide ions, followed by electroless (autocatalytic) deposition of metal such as palladium or metal alloy such as Ni-P alloy. |
| priorityDate |
2013-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |