http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105018022-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56 |
| filingDate | 2014-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-105018022-B |
| titleOfInvention | A kind of rapid curing light emitting diode filament packaging plastic and preparation method |
| abstract | A kind of rapid curing light emitting diode filament packaging plastic and preparation method, preparation method is：(1) component containing vinyl is taken：Silica modified vinyl methyl silicone oil, vinyl silicone oil, methyl vinyl MQ silicon resin stirs；(2) weigh：Inhibitor, tackifier, cassette platinum catalyst, Methyl Hydrogen Polysiloxane Fluid；(3) each component of step (2) is added in the mixture of step (1) acquisition, stirred, rapid curing light emitting diode filament packaging plastic is made.A kind of rapid curing light emitting diode filament packaging plastic of the present invention, with high thixotropic energy, does not flow after dispensing, being capable of rapid curing at 80 DEG C.Light transmittance is more than 98%.Strong, high-low temperature resistant impact is bonded with glass and chip, it is reflux-resisting welded, for a long time using not turning yellow.Encapsulate after adhesive curing, there is excellent bond effect to LED core plate substrate and silver coating, refraction coefficient 1.40~1.43, hardness is moderate with pliability. |
| priorityDate | 2014-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 116.