http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104992904-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D3-105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67051 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D1-36 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306 |
| filingDate | 2014-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2018-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-104992904-B |
| titleOfInvention | Substrate processing method using same and substrate board treatment |
| abstract | The present invention provides a kind of substrate processing method using same and substrate board treatment.Substrate processing method using same includes：The SPM of high temperature, is supplied to the upper surface of substrate by SPM supply step；DIW supply step, after SPM supply step, by the way that the DIW of room temperature to be supplied to the upper surface of substrate, to rinse the liquid remained on substrate；Hydrogen peroxide supply step, after SPM supply step and before DIW supply step, in the state of SPM is remained on substrate, by liquid temperature is lower than the temperature of SPM and room temperature more than hydrogen peroxide be supplied to substrate upper surface hydrogen peroxide supply step；With with hydrogen peroxide supply step parallel form, the temperature reduction that the pure water of high temperature is supplied to the lower surface of substrate suppresses process. |
| priorityDate | 2013-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.