abstract |
The present invention relates to a kind of for semiconductor chip to be sticked to the rubber composition on SR substrate, in more detail, it is related to a kind of silicones comprising with vinyl, hydrogen containing siloxane, tackifier, the spherical silicon particle with specific reactivity functional group, inorganic silicon dioxide filler, hydrosilylation reaction catalyst, and reacts retarding agent and there is the reliability of raising and the rubber composition for attaching semiconductor chip of adhesion. |