| abstract |
The present invention provides an underfill material that realizes void-free mounting and good solder bondability, and a method of manufacturing a semiconductor device using the same. Using an underfill material containing an epoxy resin and a hardener, the time for the reaction rate to reach 20% at 240° C. calculated by the Ozawa method using a differential scanning calorimeter was 2.0 seconds or less, and the reaction rate reached 60 % time is 3.0 seconds or more. As a result, void-free mounting and good solder bondability can be achieved. |