http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104955914-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31058 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 |
| filingDate | 2014-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-104955914-B |
| titleOfInvention | Chemical-mechanical polishing compositions containing zirconium oxide and metal onidiges |
| abstract | The present invention provides a kind of chemical-mechanical polishing compositions and a kind of method that substrate is polished in chemical machinery mode using the chemical-mechanical polishing compositions.The polishing composition includes：A () abrasive particles, the wherein abrasive particles include zirconium oxide, (b) at least one metal ion oxidizers, wherein at least one metal ion oxidizers include Co 3+ 、Au + 、Ag + 、Pt 2+ 、Hg 2+ 、Cr 3+ 、Fe 3+ 、Ce 4+ Or Cu 2+ Metal ion, and (c) aqueous carrier, the wherein pH of the chemical-mechanical polishing compositions are in the range of 1 to 7, and wherein the chemical-mechanical polishing compositions do not include peroxy-type oxidizer. |
| priorityDate | 2013-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 69.