| abstract |
The present invention provides a kind of chips, including：Semiconductor substrate, the integrated circuit being at least partially disposed in semiconductor substrate and the surface dielectric layer above integrated circuit.Multiple metal pads are substantially uniformly distributed in the substantially whole surface of chip.The top surface of multiple metal pads and the top surface of surface dielectric layer are in same level.Multiple metal pads include active metal pad and pseudo- metal pad.Active Metal pad is electrically connected to integrated circuit.Pseudo- metal pad is electrically separated from integrated circuit.The invention further relates to the mixing engagements with uniform pattern density. |